High-Performance 10mm Aluminum Nitride (AlN) Substrate for Enhanced Thermal Management and Reliability in Electronics – Optimal Heat Dissipation Solution - Sapphire Wafer_Silicon Wafer_SIC Wafer_GaAs Substrate_ZnSe Windows

Aluminum Nitride (AlN) Substrate‘s product description

Aluminum Nitride (AlN) is increasingly recognized as a pivotal material in the realm of advanced technological applications, particularly where superior thermal management and electrical insulation are paramount. With its unparalleled thermal conductivity of 170 W/mK, Aluminum Nitride (AlN) Substrate stands as the epitome of thermally conductive materials that also possess robust electrical insulating properties. This unique combination renders it an indispensable resource in various high-demand applications, especially those requiring efficient heat dissipation away from critical components.

The OCTO brand, known for its quality and innovation, offers blank aluminum nitride substrates that cater to a wide array of needs in the technology and manufacturing sectors. These substrates are not just any materials; they are the backbone of heat management in sophisticated devices. Available in various sizes and thicknesses, they are designed to meet the stringent requirements of today’s high-power, high-performance components. Whether it’s power LEDs, high-power integrated circuits (ICs), or high-voltage inductors, Aluminum Nitride (AlN) Substrate from OCTO provide the foundation for reliability and efficiency.

One of the most compelling attributes of aluminum nitride is its low coefficient of thermal expansion (CTE), which is remarkably similar to that of silicon and other ceramic materials. This characteristic ensures a harmonious CTE match between the AlN substrate and attached components, minimizing the risk of thermal stress and enhancing the overall durability and lifespan of the device. This property is particularly critical in environments subject to rapid temperature changes or extreme conditions.

Beyond its thermal and electrical benefits, AlN is celebrated for its mechanical robustness, non-toxicity, and resistance to thermal shock and chemicals. These features make it not only safe but also versatile, capable of withstanding harsh environments without compromising performance. Its low dielectric constant and excellent mechanical properties further accentuate its suitability for high-frequency, high-voltage, and high-temperature applications.

Understanding the diverse needs of the industry, OCTO has made these high-quality AlN substrates readily available through a large and live inventory, ensuring fast shipping and prompt start of projects. The flexibility offered by OCTO extends to customized solutions; for those requiring custom sizes or 2D laser-machined Aluminum Nitride (AlN) Substrate, the company provides easy online quoting and ordering processes, facilitating a seamless transition from concept to implementation.

The integration of Aluminum Nitride (AlN) Substrate into device packaging and submounts marks a significant leap forward in the quest for more efficient, reliable, and high-performing electronic and optical devices. The material’s superior properties, coupled with OCTO’s commitment to quality and customer service, make this range of Aluminum Nitride (AlN) Substrate an optimal choice for engineers, designers, and manufacturers looking to push the boundaries of what’s possible.

In conclusion, the dawn of aluminum nitride (AlN) substrates heralds a new era in materials science, one that promises enhanced performance and reliability in a variety of applications. As the demand for more powerful, compact, and efficient devices continues to grow, the role of Aluminum Nitride (AlN) Substrate becomes increasingly vital. With OCTO’s cutting-edge offerings, the future of thermal management and electrical insulation looks brighter than ever. Whether for standard applications or tailor-made solutions, Aluminum Nitride (AlN) Substrates are paving the way towards technological advancements that will define the next generation of electronic and photonic devices.

Aluminum Nitride (AlN) Substrate‘s data chart（partly）

Material		Aluminum Nitride Substrate
	Surface Roughness (μm)		Ra = 0.02~0.05
	Breakdown Strength (KV/mm)		18.45
	Wrap (Length ‰)		≤ 2
	Volume Resistivity (Ω·cm)		1.4 X 10¹⁴
	Density (g/cm^3)		3.34
	Front Surface Finish		Polished
	Back Surface Finish		Lapped
	Thermal conductivity (W/m.K)		≥ 180
	Thermal expansion (x 10^-6/°C)		2.90
	Dielectric Constant (@1MHz)		8.7
	Flexural Strength		450
	Loss Tangent (X10^-4 @ 1MHz)		5

Aluminum Nitride (AlN) Substrate‘s applications

Aluminum Nitride (AlN) substrates are utilized across a diverse range of industries and applications due to their exceptional thermal conductivity, electrical insulation properties, and mechanical strength. Here’s a comprehensive list of applications where AlN substrates are typically employed:

Electronics Cooling: Aluminum Nitride (AlN) Substrate are used in electronic cooling solutions due to their high thermal conductivity, helping to dissipate heat from electronic components like high-power transistors, integrated circuits (ICs), and LEDs.
Power Electronics: They are employed in power electronic devices for improved heat management, contributing to longer lifespan and enhanced performance of devices such as converters and inverters.
RF and Microwave Components: Aluminum Nitride (AlN) Substrate are utilized in radio-frequency (RF) and microwave components due to their low dielectric constant and loss tangent, enhancing signal integrity in applications such as mobile phones, radar systems, and satellite communications.
Optoelectronics: They are used in optoelectronic devices like laser diodes, photodiodes, and UV LEDs due to their ability to manage heat effectively while providing electrical insulation.
Semiconductor Packaging:Aluminum Nitride (AlN) Substrate serve as excellent bases for semiconductor packaging, particularly for high-temperature operations, due to their thermal conductivity and coefficient of thermal expansion (CTE) that matches silicon.
LED Lighting: In LED technology, AlN substrates help in heat dissipation, which is crucial for maintaining the efficiency and lifespan of LEDs.
Automotive Electronics: They are used in automotive electronics for heat management in sensors, power modules, and other critical components, contributing to safety and reliability in vehicles.
High-Power Lasers: Aluminum Nitride (AlN) Substrate are utilized in high-power laser systems where efficient heat dissipation is essential for maintaining laser performance and stability.

Piezoelectric Sensors and Actuators: Due to their piezoelectric properties, AlN substrates are used in the manufacturing of piezoelectric sensors and actuators, which find applications in medical devices, automotive systems, and industrial equipment.
Thermal Management Solutions: They are used in various thermal management applications, including heat sinks and heat spreaders, to enhance cooling efficiency in electronics and other devices.
High-Frequency PCBs: Aluminum Nitride (AlN) Substrates are used in high-frequency printed circuit boards (PCBs) for better thermal management and reduced signal loss, crucial in aerospace and defense electronics.
Acoustic Devices: They are employed in bulk acoustic wave (BAW) and surface acoustic wave (SAW) devices used in RF filters for telecommunications.
Medical Devices: In medical technology, AlN substrates are used for their biocompatibility and excellent thermal properties in devices such as ultrasound transducers and surgical equipment.
Photonics: They are utilized in photonic devices for their excellent thermal and electrical properties, contributing to the development of advanced optical systems.
Nuclear Instruments: Due to their radiation resistance, Aluminum Nitride (AlN) Substrate are used in nuclear instrumentation and detectors.
MEMS (Micro-Electro-Mechanical Systems): AlN is used in MEMS devices for its mechanical strength and stability under high temperatures.

Aluminum Nitride (AlN) Substrate‘s properties

Aluminum Nitride (AlN) substrates offer a unique set of properties that make them particularly suitable for a wide range of high-tech applications. Here’s a detailed list of their key properties:

High Thermal Conductivity: AlN has one of the highest thermal conductivities among ceramic materials, typically around 170-200 W/mK, which allows for excellent heat dissipation.
Electrical Insulation: Despite its high thermal conductivity, AlN is an excellent electrical insulator, providing high electrical resistance and low dielectric constant, making it ideal for electronic applications.
High Temperature Stability: AlN substrates can withstand high temperatures, maintaining their structural integrity and properties under extreme heat.
Low Coefficient of Thermal Expansion (CTE): Aluminum Nitride (AlN) Substrate has a CTE similar to that of silicon, which minimizes thermal stress between materials when they are subjected to temperature changes, making it ideal for semiconductor applications.
Mechanical Strength: AlN substrates exhibit high mechanical strength, making them durable and resistant to physical stress and strain.
Corrosion Resistance: They are resistant to corrosion and do not react with most molten metals, acids, and alkalis, which makes them suitable for harsh environments.
High Density: AlN is typically produced with a high density, which minimizes porosity and improves its overall strength and thermal conductivity.
Low Dielectric Constant and Loss Tangent: This property makes AlN substrates suitable for RF and microwave applications, as they can support high-frequency signals without significant loss of energy.
Non-Toxic: Unlike some other ceramic materials, AlN does not contain toxic elements and is generally considered safe for use in all types of applications, including medical devices.
Radiation Resistance: AlN can withstand exposure to radiation, making it suitable for nuclear applications and space technology.
Optical Transparency in the Deep Ultraviolet (UV) Range: This makes AlN useful in optoelectronics and photonics, especially in UV LED applications.
Piezoelectric Properties: Certain grades of AlN exhibit piezoelectric properties, which can be exploited in sensors, actuators, and transducers.
Wear Resistance: AlN substrates are wear-resistant, which makes them suitable for use in environments where abrasion and erosion are concerns.
Thermal Shock Resistance: They can withstand rapid changes in temperature without cracking or deteriorating, which is critical for many industrial and aerospace applications.
Chemical Stability: AlN is chemically stable and resistant to attack by most processing chemicals and plasmas, making it ideal for semiconductor fabrication and other chemical processing applications.
Biocompatibility: Certain types of AlN are biocompatible, making them suitable for use in medical devices and implants.

The combination of these properties makes Aluminum Nitride (AlN) substrates exceptionally useful across a wide range of industries, from electronics and semiconductors to aerospace and biomedical applications. Their unique thermal, electrical, and mechanical properties enable the development of more efficient, reliable, and higher-performing devices and systems.

The fabrication process of Aluminum Nitride (AlN) substrates

The fabrication process of Aluminum Nitride (AlN) substrates involves several steps, each critical to ensuring the final product’s quality and performance. Here’s a detailed look at the typical manufacturing process:

Powder Synthesis: The process begins with the synthesis of AlN powder. This can be achieved through various methods, such as direct nitridation of aluminum or carbothermal reduction and nitridation using aluminum oxide and carbon in a nitrogen atmosphere.
Milling: The synthesized AlN powder is then milled to reduce its particle size to the desired level. This step is crucial as it influences the material’s sinterability and, ultimately, the density and mechanical properties of the final substrate.
Mixing: After milling, the AlN powder is mixed with sintering aids or additives, which help in the densification process during sintering. The choice and amount of these additives can significantly affect the substrate’s thermal and electrical properties.
Forming: The mixed powder is then formed into the desired shape using methods such as dry pressing, isostatic pressing, or tape casting. The forming method chosen depends on the required substrate size, thickness, and volume.
Sintering: The formed AlN body is sintered at high temperatures (typically above 1800°C) in a nitrogen atmosphere. Sintering densifies the body by causing the particles to bond at their edges and removes any remaining porosity, resulting in a high-density, high-purity AlN substrate. The sintering atmosphere, temperature, and time are critical parameters that influence the material’s microstructure and properties.
Annealing: After sintering, the AlN substrate may undergo an annealing process to relieve internal stresses and improve mechanical and thermal properties. This step is performed under controlled conditions to prevent any deterioration in material quality.
Surface Finishing: The sintered AlN substrates are then subjected to surface finishing processes, such as grinding and polishing, to achieve the desired surface roughness and dimensional tolerances. This step is crucial for applications requiring tight tolerances and high surface quality.
Cutting and Shaping: If required, the substrates are then cut to specific dimensions and shapes using techniques like diamond sawing or laser cutting. This step must be done with precision to ensure the substrates meet the specified requirements.
Cleaning: After cutting and shaping, the AlN substrates undergo a thorough cleaning process to remove any surface contaminants and residues from previous processing steps. Cleaning is essential to ensure the substrate’s performance in its final application.
Inspection and Packaging: Finally, the substrates are inspected for quality and compliance with customer specifications. Parameters such as thickness, surface roughness, and thermal conductivity are checked. Once they pass inspection, the substrates are carefully packaged and prepared for shipping to ensure they reach the customer in perfect condition.

This manufacturing process highlights the complexity and precision required to produce high-quality Aluminum Nitride (AlN) substrates. Each step, from powder synthesis to final inspection, plays a vital role in determining the substrate’s performance in its end-use application.

Q&A

What is aluminum nitride AlN substrate?

Aluminum Nitride (AlN) is the best available thermally conductive material (170 W/mK) that is also a strong electric insulator. It is therefore used in a variety of applications where heat needs to be transferred away from a component.

What is the thermal conductivity of AlN substrate?

Aluminium nitride is stable in hydrogen and carbon-dioxide atmospheres up to 980 °C (1,250 K; 1,800 °F). The material dissolves slowly in mineral acids through grain-boundary attack and in strong alkalies through attack on the aluminium-nitride grains. The material hydrolyzes slowly in water.

Is aluminum a metal substrate?

Metal substrates are typically made of aluminum or copper, and their key advantages include: 1. Excellent thermal conductivity: Metal substrates have high thermal conductivity, which helps to dissipate heat generated during operation.

Our service

Optimizing Performance with Customized Aluminum Nitride (AlN) Substrates: Our Commitment to Quality and Service

In the rapidly evolving landscape of electronic and thermal management solutions, the demand for high-performance materials has never been greater. Among these, Aluminum Nitride (AlN) substrates stand out for their exceptional properties, catering to a wide range of industrial applications. Our company is at the forefront of this innovation, specializing in the customization and supply of AlN substrates. We are dedicated to providing products that meet the highest standards of quality and performance, coupled with unparalleled service and timely delivery.

Customization at Its Best

Understanding the unique needs of each application, we offer customized solutions for our AlN substrates. Our team works closely with clients to understand their specific requirements, including dimensions, thickness, and thermal conductivity needs. This collaborative approach ensures that the final product is precisely tailored to fit the application, whether it’s for electronics cooling, semiconductor packaging, or optoelectronic devices.

Our customization process is backed by a deep understanding of AlN properties and state-of-the-art manufacturing techniques. We leverage advanced technologies in powder synthesis, forming, sintering, and surface finishing to produce substrates that meet exact specifications. This flexibility in customization allows our clients to push the boundaries of what’s possible in their respective fields, leading to innovations that can redefine industries.

Commitment to Quality

Quality is the cornerstone of our service. We employ stringent quality control measures at every stage of the production process, from raw material selection to final inspection. Our AlN substrates are manufactured under closely monitored conditions, ensuring that they exhibit high thermal conductivity, excellent electrical insulation, and superior mechanical strength.

We understand that the performance of our substrates can significantly impact the efficiency and reliability of our clients’ products. Therefore, we do not compromise on quality, ensuring that each substrate delivered is free of defects and meets the high standards expected by our customers.

Timely Delivery and Excellent After-Sales Service

We recognize the importance of timely delivery in keeping our clients’ projects on schedule. Our logistics team ensures that all orders are processed promptly and delivered on time, without compromising the safety and integrity of the products. We understand that our clients operate in fast-paced environments where delays can have significant repercussions. Therefore, we are committed to providing reliable and efficient delivery services.

Our commitment to our clients extends beyond the point of sale. We offer comprehensive after-sales services, including technical support, product maintenance tips, and handling any issues that may arise. Our customer service team is always ready to assist with any inquiries or concerns, ensuring that our clients have a smooth and satisfactory experience with our products.

Partnering for Success

By choosing our customized AlN substrates, our clients benefit from a partner who is committed to their success. We not only provide a product but also a promise of quality, reliability, and service. Our aim is to contribute to the success of our clients’ projects, enabling advancements in technology and innovation.

In conclusion, our customized Aluminum Nitride (AlN) substrates represent the pinnacle of performance and quality. Coupled with our dedication to timely delivery and exceptional service, we provide our clients with a competitive edge in their respective markets. We invite you to experience the difference that our products and services can make in your next project. Together, we can drive innovation and achieve extraordinary results.

High-Performance 10mm Aluminum Nitride (AlN) Substrate for Enhanced Thermal Management and Reliability in Electronics – Optimal Heat Dissipation Solution